Customization
Underfill
Underfill provides a strong mechanical bond between key components and the underlying printed circuit board (PCB). By spreading stresses throughout the chip and PCB interface with a mechanical bond, less stress is concentrated on the solder joints, increasing device reliability.
Conformal Coating
Conformal coatings can be applied via a range of methods including manual brushing, manual spraying, dipping, or by automated spraying machines.
Wide Temperature
To ensure that all of its devices can be operated under even the harshest conditions, Transcend utilizes wide temperature technology, allowing our flash and DRAM modules to operate and perform reliably in extreme temperatures.